Edge-firing antenna walls built into substrate
US10658765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jun 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/285
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of forming a planar antenna on a first substrate. An antenna feedline is formed on a peelable copper film of a carrier. A dielectric with no internal conductive layer is formed on the feedline. A planar antenna is formed on one of two parallel sides of the dielectric and a feed port is formed adjacent the other parallel side. The feedline connects the antenna with the feed port. One plane of the planar antenna is configured for perpendicular attachment to a second substrate. The feedline is connected to the planar antenna by a via through the dielectric. The peelable copper is removed and the structure is etched to produce the planar antenna on the substrate. Two planar antennas on substrates can be perpendicularly attached to another substrate to form side-firing antennas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.