Thin film capacitors for core and adjacent build up layers
US10660209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Mar 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method includes affixing a capacitor sheet adjacent to core material of a device substrate, where the capacitor sheet covers a surface of the core material. The method also includes patterning first openings through both capacitor sheet and the core material, where the first openings are larger than a substrate pass through-hole. The method additionally includes filling the first openings with an electrically inert material. The method further includes patterning a second openings parallel to the first openings through the electrically inert material, where the second openings are at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.