Methods for connecting inter-layer conductors and components in 3D structures
US10660214B2 · kind B2 · utility
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17References
20Claims
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Key dates
| Filing date | Jun 17, 2016 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Feb 23, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5193
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.