Patent · US Active

Apparatus for cleaning a polishing surface, polishing apparatus, and method of manufacturing an apparatus for cleaning a polishing surface

US10661411B2 · kind B2 · utility

0Cited by

7References

10Claims

0Family size

Assignee

EBARA CORPORATION · JP

Inventors

Ryuichi Kosuge · Tokyo, JP
Hiroshi Sotozaki · Tokyo, JP
Takeshi Kodera · Tokyo, JP
Ryo Hasegawa · Saitama, JP

Key dates

Filing date	Nov 17, 2015
Grant date	May 26, 2020
Priority date	—
Expiry date	Dec 11, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/20
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

There is disclosed a polishing-surface cleaning apparatus to which a polishing liquid, such as slurry, is less likely to be attached. The polishing-surface cleaning apparatus includes an arm having a fluid passage, a nozzle communicating with the fluid passage, and a weld material securing the nozzle to the arm. The weld material fills a gap between a bottom surface of the arm and an edge of a front-end surface of the nozzle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.