Electronic package cover having underside rib
US10665524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Sep 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92125
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package lid which includes one or more underside ribs. The ribs have a major length and a minor width and are generally aligned to be parallel with a diagonal or normal bisector of the processing device. The underside rib generally stiffens the cover such that an upper surface of the cover is more apt to stay flat. As such, cover warpage and, therefore, the peeling of the TIM1 and delamination of underfill due to the physical or dimensional expansion of the processing device and/or a carrier may be reduced. As a result, the surface area dedicated for the seal material upon the carrier surface may be reduced, thereby increasing the available surface area upon the carrier for additional electronic components to be placed in close proximity to the processing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.