Heat transfer for power modules
US10665525B2 · kind B2 · utility
1Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jun 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.