Die tool, device and method for producing a lens wafer
US10668678B2 · kind B2 · utility
0Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2017 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Mar 29, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B3/0031
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.