Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same
US10672718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2016 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Jan 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are, for instance, methods for producing through package vias in a glass interposer. For instance, disclosed herein is a method for producing through package vias in a glass interposer comprising laminating a polymer on at least a portion of a top surface of a glass interposer, removing at least a portion of the polymer and the glass interposer to form a through via, filling at least a portion of the through via with a metal conductor to form a metallization layer, and selectively removing a portion of the metallization layer to form a metalized through package via. Other methods are also disclosed, along with through-package-via structures in glass interposers produced therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.