Fuhan Liu
4Patents
3h-index
10Co-inventors
43Inventor score
Filing activity: Apr 20, 2010 → Jan 25, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8536695B2 | Chip-last embedded interconnect structures | Electricity | 49 | Active |
| US9275934B2 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Electricity | 38 | Active |
| US8391017B2 | Thin-film capacitor structures embedded in semiconductor packages and methods of making | Electricity | 4 | Active |
| US10672718B2 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.