Substrate processing apparatus having cooling member
US10679845B2 · kind B2 · utility
4Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2017 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Feb 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02054
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.