Patent · US Active

Engineered polymer-based electronic materials

US10682732B2 · kind B2 · utility

0Cited by

0References

18Claims

0Family size

Assignee

ALPHA ASSEMBLY SOLUTIONS INC. · US

Inventors

Ramakrishna Hosur Venkatagiriyappa · Bengaluru, IN
Morgana de Avila Ribas · Waterbury, US
Barun Das · Bengaluru, IN
Harish Hanchina Siddappa · Bengaluru, IN
Sutapa Mukherjee · South Plainfield, US
Siuli Sarkar · South Plainfield, US
Bawa Singh · Cherry Hill, US
Rahul Raut · Edison, US
Ranjit Pandher · South Plainfield, US

Key dates

Filing date	Mar 31, 2016
Grant date	Jun 16, 2020
Priority date	—
Expiry date	Jun 1, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3841
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.