Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device
US10684412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2016 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Nov 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.