Patent · US Active

Multi-scale simulation including first principles band structure extraction

US10685156B2 · kind B2 · utility

0Cited by

20References

40Claims

0Family size

Assignee

SYNOPSYS, INC. · US

Inventors

Jie Liu · San Jose, US
Victor Moroz · Saratoga, US
Michael C. Shaughnessy-Culver · Napa, US
Stephen Lee Smith · Tempe, US
Yong-Seog Oh · Pleasanton, US
Pratheep Balasingam · San Jose, US
Terry Sylvan Kam-Chiu Ma · Danville, US

Key dates

Filing date	Jul 29, 2016
Grant date	Jun 16, 2020
Priority date	—
Expiry date	Jun 11, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG16C10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Electronic design automation modules include a first tool and a second tool. The first tool includes ab initio simulation procedures configured to use input parameters to produce information about a band structure of a simulated material on a first simulation scale specified at least in part by the input parameters. The second tool includes a simulation procedure configured to used information about the band structure of the simulated material produced by the first tool to extract parameters on a second simulation scale larger than the first simulation scale.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.