Substrate processing apparatus
US10688622B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2017 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | May 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.