Patent · US Active

Method and device for alignment of substrates

US10692747B2 · kind B2 · utility

2Cited by

8References

18Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Thomas Wagenleitner · Lauterbrunn, AT
Dominik Zinner · Ried im Innkreis, AT
Jurgen Markus Suss · Rainbach, AT
Christian Sinn · Gießen, DE
Jurgen Mallinger · Ried im Innkreis, AT

Key dates

Filing date	Aug 29, 2016
Grant date	Jun 23, 2020
Priority date	—
Expiry date	Aug 29, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/54426
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.