Thomas Wagenleitner
45Patents
6h-index
25Co-inventors
65Inventor score
Filing activity: Feb 8, 2006 → May 3, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9312161B2 | Accommodating device for retaining wafers | Electricity | 19 | Active |
| US7304534B2 | Amplifier arrangement, and method for compensating for an offset | Electricity | 14 | Expired |
| US9613840B2 | Apparatus and method for bonding substrates | Emerging Cross-Sectional Technologies | 11 | Active |
| US10109487B2 | Method for bonding substrates | Electricity | 8 | Active |
| US10325798B2 | Accommodating device for retaining wafers | Electricity | 6 | Active |
| US9851645B2 | Device and method for aligning substrates | Electricity | 6 | Active |
| US10279575B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 6 | Active |
| US11282706B2 | Device and method for bonding of substrates | Electricity | 5 | Active |
| US10943807B2 | Method and device for alignment of substrates | Electricity | 3 | Active |
| US10692747B2 | Method and device for alignment of substrates | Electricity | 2 | Active |
| US10636662B2 | Device and method for bonding of substrates | Electricity | 2 | Active |
| US10886156B2 | Accomodating device for retaining wafers | Electricity | 2 | Active |
| US10954122B2 | Method for bonding of at least three substrates | Electricity | 2 | Active |
| US11315813B2 | Substrate holder and method for bonding two substrates | Electricity | 2 | Active |
| US9595094B2 | Measuring form changes of a substrate | Electricity | 1 | Active |
| US11121091B2 | Method for arranging two substrates | Electricity | 1 | Active |
| US8714611B2 | Handling device for handling of a wafer | Electricity | 1 | Active |
| US10748770B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US11315901B2 | Method for bonding substrates | Electricity | 1 | Active |
| US11527410B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US10991609B2 | Method and substrate holder for the controlled bonding of substrates | Electricity | 1 | Active |
| US10861699B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US11059280B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 1 | Active |
| US11355374B2 | Accommodating device for retaining wafers | Electricity | 1 | Active |
| US10504730B2 | Device and method for bonding of substates | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.