Patent · US Active

Chip package assembly with modular core dice

US10692837B1 · kind B1 · utility

30Cited by

0References

18Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Myongseob Kim · Pleasanton, US
Henley Liu · San Jose, US
Cheang-Whang Chang · Mountain View, US
Nui Chong · San Jose, US

Key dates

Filing date	Jul 20, 2018
Grant date	Jun 23, 2020
Priority date	—
Expiry date	Jul 20, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package assembly and method for fabricating the same are provided which utilize at least one modular core dice to reduce the cost of manufacture. The modular core dice include at least two die disposed on a wafer segment that are separated by a scribe lane. In one example, a chip package assembly is provided that includes an interconnect substrate stacked below a first wafer segment. The first wafer segment has a first die spaced from a second die by a first scribe lane. The interconnect substrate has conductive routing that is electrically connected to the first die and the second die through die connections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.