Buffer chamber wafer heating mechanism and supporting robots

US10699930B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• William T. Weaver · Austin, US
• Jason M. Schaller · Austin, US
• Robert Brent Vopat · Austin, US
• David Blahnik · Round Rock, US
• Benjamin B. Riordon · Newburyport, US
• Paul E. Pergande · Beverly Hills, US

Key dates

• Filing date: Sep 11, 2018
• Grant date: Jun 30, 2020
• Expiry date: Sep 11, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68771
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.