SMD package with top side cooling

US10699978B2 · kind B2 · utility

Assignee

• Infineon Technologies Austria AG · AT

Inventors

• Ralf Otremba · Kaufbeuren, DE
• Amirul Afiq Hud · Melaka City, MY
• Teck Sim Lee · Melaka City, MY
• Xaver Schloegel · Sachsenkam, DE
• Bernd Schmoelzer · Radenthein, AT

Key dates

• Filing date: Sep 7, 2018
• Grant date: Jun 30, 2020
• Expiry date: Sep 7, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/49541
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A package encloses a power semiconductor die and has a package body with a package top side, package footprint side and package sidewalls. The die has first and second load terminals for blocking a blocking voltage. A lead frame structure electrically and mechanically couples the package to a support and includes an outside terminal extending out of the package footprint side and/or the sidewalls, and is electrically connected with the first load terminal. A top layer arranged at the package top side is electrically connected with the second load terminal. A creepage length between the electrical potential of the outside terminal and the electrical potential of the top layer is defined by a package body surface contour. The surface contour is formed at least by the package top side and package sidewall. At least one structural feature also forms the surface contour is configured to increase the creepage length.