Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
US10700011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2017 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Nov 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate with a first opening and second opening formed in the substrate. A first semiconductor component is disposed on the substrate. The substrate is disposed on a carrier. A second semiconductor component is disposed on the carrier in the first opening of the substrate. A third semiconductor component is disposed in the second opening. The third semiconductor component is a semiconductor package in some embodiments. A first shielding layer may be formed over the semiconductor package. An encapsulant is deposited over the substrate, first semiconductor component, and second semiconductor component. A shielding layer may be formed over the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.