HeeSoo Lee
76Patents
6h-index
104Co-inventors
75Inventor score
Filing activity: Nov 21, 2003 → Feb 13, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8577284B2 | Cooperative reception diversity apparatus and method based on signal point rearrangement or superposition modulation in relay system | Electricity | 102 | Active |
| US8725067B2 | Self-interference cancellation method and apparatus of relay using the same frequency band in OFDM-based radio communication system | Electricity | 19 | Active |
| US8593936B2 | Carrier aggregation in wireless communication systems | Electricity | 10 | Active |
| US9171739B1 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | Electricity | 9 | Active |
| US8363537B2 | Carrier aggregation in wireless communication system | Electricity | 8 | Active |
| US10636765B2 | System-in-package with double-sided molding | Electricity | 8 | Active |
| US9693455B1 | Integrated circuit packaging system with plated copper posts and method of manufacture thereof | Electricity | 6 | Active |
| US8971168B2 | Carrier aggregation in wireless communications systems | Electricity | 5 | Active |
| US10797039B2 | Semiconductor device and method of forming a 3D interposer system-in-package module | Electricity | 5 | Active |
| US9124313B2 | Multi-cell cooperative communication system and terminal device | Electricity | 5 | Active |
| US10700011B2 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | Electricity | 5 | Active |
| US10797024B2 | System-in-package with double-sided molding | Electricity | 4 | Active |
| US10636774B2 | Semiconductor device and method of forming a 3D integrated system-in-package module | Electricity | 4 | Active |
| US7991066B2 | Transmitter, receiver and method for controlling multiple input multiple output system | Electricity | 4 | Active |
| US10937741B2 | Molded laser package with electromagnetic interference shield and method of making | Electricity | 4 | Active |
| US10636756B2 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | Electricity | 4 | Active |
| US9859200B2 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | Electricity | 4 | Active |
| US8139498B2 | Method and apparatus for determining reporting period of channel quality information in multi-carrier wireless system | Electricity | 3 | Active |
| US9007979B2 | Apparatus and method for transmitting and receiving data in wireless communication system using relay | Electricity | 3 | Active |
| US10075276B2 | Carrier aggregation in wireless communication systems | Electricity | 3 | Active |
| US10468384B2 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | Electricity | 3 | Active |
| US8149769B2 | Apparatus and method of transmitting and receiving reception acknowledgment signal in mobile communication system | Electricity | 2 | Active |
| US11189598B2 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | Electricity | 2 | Active |
| US10938534B2 | Carrier aggregation in wireless communication systems | Electricity | 1 | Active |
| US11664327B2 | Selective EMI shielding using preformed mask | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.