Polishing apparatus
US10702972B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2014 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Apr 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.