Automated generation of surface-mount package design
US10706204B2 · kind B2 · utility
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6References
17Claims
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Key dates
| Filing date | Oct 2, 2018 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Oct 2, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.