Substrate treating apparatus and substrate treating method
US10707101B2 · kind B2 · utility
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17Claims
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Assignee
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Key dates
| Filing date | Aug 15, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Aug 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.