Power module with improved reliability
US10707858B2 · kind B2 · utility
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2References
21Claims
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Assignee
Inventors
Key dates
| Filing date | May 15, 2018 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | May 15, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes a first terminal, a second terminal, and a number of semiconductor die coupled between the first terminal and the second terminal. The semiconductor die are configured to provide a low-resistance path for current flow from the first terminal to the second terminal during a forward conduction mode of operation and a high-resistance path for current flow from the first terminal to the second terminal during a forward blocking configuration. Due to improvements made to the power module, it is able to pass a temperature, humidity, and bias test at 80% of its rated voltage for at least 1000 hours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.