Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
US10709023B2 · kind B2 · utility
0Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2015 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Apr 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.