Photoresists comprising amide component

US10719014B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials LLC · US

Inventors

• Cong Liu · Lanzhou, CN
• Chunyi Wu · Shrewsbury, US
• Gerhard Pohlers · Needham, US
• Gregory P. Prokopowicz · Worcester, US
• Mingqi Li · Sammamish, US
• Cheng-Bai Xu · Upton, US

Key dates

• Filing date: Jun 25, 2013
• Grant date: Jul 21, 2020
• Expiry date: Jun 25, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/2041
• WIPO field: Organic fine chemistry
• WIPO sector: Chemistry

Abstract

New photoresist compositions are provided that comprise a component that comprises an amide group and multiple hydroxyl groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and an amide component with multiple hydroxyl groups that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer.