Pre-cleaning for etching of dielectric materials
US10720337B2 · kind B2 · utility
1Cited by
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27Claims
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Key dates
| Filing date | Jul 20, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Jul 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An etching process is provided that includes a pre-clean process to remove a surface oxide of a dielectric material. The removal of the oxide can be executed through a thermal reaction and/or plasma process before the etch process. In some embodiments, the removal of the oxide increases etch process control and reproducibility and can improve the selectivity versus oxides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.