Patent · US Active

Pre-cleaning for etching of dielectric materials

US10720337B2 · kind B2 · utility

1Cited by
0References
27Claims
0Family size

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Inventors

Key dates

Filing dateJul 20, 2018
Grant dateJul 21, 2020
Priority date
Expiry dateJul 20, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67069
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An etching process is provided that includes a pre-clean process to remove a surface oxide of a dielectric material. The removal of the oxide can be executed through a thermal reaction and/or plasma process before the etch process. In some embodiments, the removal of the oxide increases etch process control and reproducibility and can improve the selectivity versus oxides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.