Thermally enhanced fully molded fan-out module
US10720417B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 11, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | May 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a molded core unit that includes a first semiconductor die with conductive interconnects and a second semiconductor with conductive interconnects. The first semiconductor die and the second semiconductor die are encapsulated by a single encapsulant that contacts at least four sides surfaces and an active surface of the first semiconductor die and the second semiconductor die, as well as side surfaces of the conductive interconnects. The molded core unit further includes a fine-pitch build-up interconnect structure disposed over the encapsulant and coupled to the conductive interconnects of the first semiconductor die and the conductive interconnects of the second semiconductor die interconnected without a silicon interposer. The molded core unit can be mounted to an organic multi-layer substrate. A heat sink may be coupled to the back surfaces of the first semiconductor die and the second semiconductor die with a thermal interface material (TIM).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.