Piezoelectric package-integrated acoustic transducer devices

US10721568B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Georgios Dogiamis · Chandler, US
• Feras Eid · Chandler, US
• Adel A. Elsherbini · Chandler, US
• Johanna M. Swan · Scottsdale, US
• Shawna M. Liff · Scottsdale, US
• Thomas L. Sounart · Chandler, US
• Sasha N. Oster · Chandler, US

Key dates

• Filing date: Jul 1, 2016
• Grant date: Jul 21, 2020
• Expiry date: Jul 1, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/028
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.