Method and device for spreading high heat fluxes in thermal ground planes
US10724804B2 · kind B2 · utility
2Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2017 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Jan 11, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2255/20
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal ground plane with hybrid structures that include nanowires is disclosed. The thermal ground plane includes a first casing having an exterior surface and an interior surface, the interior surface includes plurality of microstructures with a plurality of nanowires; a second casing, wherein the first casing and the second casing are sealed to an interior space that includes a working fluid; and a wicking layer disposed within the interior space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.