Optimizing the utilization of metrology tools
US10725385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Aug 10, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method may include, but is not limited to, receiving a measurement including a metrology parameter for a layer of a metrology target and an alignment mark from an overlay metrology tool prior to a lithography process; deriving a merit figure from the metrology parameter and the alignment mark; deriving a correction factor from the merit figure; providing the correction factor to the lithography process via a feed forward process; receiving an additional measurement including an additional metrology parameter for the layer and an additional layer from an additional overlay metrology tool after the lithography process; deriving an adjustment from the additional metrology parameter; and providing the adjustment to the lithography process via a feedback process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.