Magnetic force release for sputtering sources with magnetic target materials
US10727034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2017 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Aug 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A magnet bar assembly for a rotary target cathode comprises a support structure, a magnet bar structure movably attached to the support structure and including a plurality of magnets, and a positioning mechanism operatively coupled to the support structure and the magnet bar structure. The positioning mechanism is configured to move the magnet bar structure between a retracted position and a deployed position while inside a magnetic target material cylinder. The retracted position substantially reduces a magnetic force between the magnets and a magnetic target material of a target cylinder when the magnet bar assembly is inserted into the target cylinder or removed from the target cylinder. The deployed position substantially increases the magnetic force between the magnets and the magnetic target material when the magnet bar assembly is in the target cylinder, and allows a magnetic field from the magnet bar structure to penetrate through the magnetic target material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.