Sputtering Components, Inc.
12Patents
9Active
12Granted
43Portfolio score
Filing activity: Feb 13, 2003 → Aug 16, 2017 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6841051B2 | High-power ion sputtering magnetron | Electricity | 34 | Expired |
| US8182662B2 | Rotary cathode for magnetron sputtering apparatus | Electricity | 30 | Active |
| USRE46599E1 | Sputtering apparatus | General | 2 | Active |
| US6905579B2 | Cylindrical magnetron target and spindle apparatus | Electricity | 2 | Expired |
| US8900428B2 | Sputtering apparatus | Electricity | 2 | Active |
| US9312108B2 | Sputtering apparatus | Electricity | 1 | Active |
| US9406487B2 | Plasma enhanced chemical vapor deposition (PECVD) source | Electricity | 1 | Active |
| US9198274B2 | Ion control for a plasma source | Electricity | 0 | Active |
| US9418823B2 | Sputtering apparatus | Electricity | 0 | Active |
| US9758862B2 | Sputtering apparatus | Electricity | 0 | Active |
| US10727034B2 | Magnetic force release for sputtering sources with magnetic target materials | Electricity | 0 | Active |
| US9362093B2 | Plasma enhanced chemical vapor deposition (PECVD) source | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.