Liquid processing method, substrate processing apparatus and recording medium
US10727042B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2017 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Mar 31, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A liquid processing method can remove pure water existing within a pattern of a substrate and replace the pure water with a solvent rapidly. The liquid processing method of supplying the pure water onto the substrate, which is horizontally held and has the pattern formed on a surface thereof, and drying the substrate includes a pure water supplying process of supplying the pure water onto the surface of the substrate; a heated solvent supplying process of supplying, after the pure water supplying process, the solvent in a liquid state, which is heated to a temperature equal to or higher than a boiling point of water, onto the surface of the substrate on which the pure water exists; and a removing process of drying the substrate by removing the solvent form the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.