Preheat processes for millisecond anneal system

US10727140B2 · kind B2 · utility

Assignees

• Mattson Technology, Inc. · US
• Beijing E-Town Semiconductor Technology Co., Ltd. · CN

Inventors

• Markus Lieberer · Augsburg, DE
• Christian Pfahler · Ulm, DE
• Markus Hagedorn · Ulm, DE
• Michael vanAbbema · Ulm, DE
• Alexandr Cosceev · Lonsee, DE

Key dates

• Filing date: Dec 13, 2016
• Grant date: Jul 28, 2020
• Expiry date: Dec 13, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68757
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Preheat processes for a millisecond anneal system are provided. In one example implementation, a preheat process can include receiving a substrate on a wafer support plate in a processing chamber of a millisecond anneal system; obtaining one or more temperature measurements of the wafer support plate using a temperature sensor; and applying a preheat recipe to heat the wafer support plate based at least in part on the temperature of the wafer support plate. In one example implementation, a preheat process can include obtaining one or more temperature measurements from a temperature sensor having a field of view of a wafer support plate in a millisecond anneal system; and applying a pulsed preheat recipe to heat the wafer support plate in the millisecond anneal system based at least in part on the one or more temperature measurements.