Beijing E-Town Semiconductor Technology Co., Ltd.
113Patents
113Active
113Granted
58Portfolio score
Filing activity: Dec 13, 2016 → Jun 27, 2024
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11062912B2 | Atomic layer etch process using plasma in conjunction with a rapid thermal activation process | Electricity | 7 | Active |
| US11043393B2 | Ozone treatment for selective silicon nitride etch over silicon | Electricity | 4 | Active |
| US11062910B2 | Surface treatment of silicon or silicon germanium surfaces using organic radicals | Electricity | 4 | Active |
| US10804109B2 | Surface treatment of silicon and carbon containing films by remote plasma with organic precursors | Electricity | 3 | Active |
| US10580672B2 | Systems and methods for workpiece processing | Electricity | 3 | Active |
| US11610824B2 | Transmission-based temperature measurement of a workpiece in a thermal processing system | Physics | 2 | Active |
| US10790119B2 | Plasma processing apparatus with post plasma gas injection | Electricity | 2 | Active |
| US10966286B2 | Nitrogen injection for ARC lamps | Electricity | 2 | Active |
| US11049692B2 | Methods for tuning plasma potential using variable mode plasma chamber | Performing Operations; Transporting | 2 | Active |
| US10950416B2 | Chamber seasoning to improve etch uniformity by reducing chemistry | Electricity | 2 | Active |
| US11101142B2 | Pre-heat processes for millisecond anneal system | Electricity | 2 | Active |
| US10580661B2 | Atomic layer etch process using plasma in conjunction with a rapid thermal activation process | Electricity | 2 | Active |
| US10573532B2 | Method for processing a workpiece using a multi-cycle thermal treatment process | Electricity | 1 | Active |
| US10901321B2 | Strip process for high aspect ratio structure | Electricity | 1 | Active |
| US10692730B1 | Silicon oxide selective dry etch process | Electricity | 1 | Active |
| US11348784B2 | Enhanced ignition in inductively coupled plasmas for workpiece processing | Emerging Cross-Sectional Technologies | 1 | Active |
| US10964528B2 | Integration of materials removal and surface treatment in semiconductor device fabrication | Electricity | 1 | Active |
| US11955388B2 | Transmission-based temperature measurement of a workpiece in a thermal processing system | Physics | 1 | Active |
| US11482434B2 | Systems and methods for workpiece processing | Electricity | 1 | Active |
| US11251026B2 | Material deposition prevention on a workpiece in a process chamber | Electricity | 1 | Active |
| US11251075B2 | Systems and methods for workpiece processing using neutral atom beams | Electricity | 1 | Active |
| US11164725B2 | Generation of hydrogen reactive species for processing of workpieces | Electricity | 1 | Active |
| US12002652B2 | Variable mode plasma chamber utilizing tunable plasma potential | Electricity | 1 | Active |
| US11257680B2 | Methods for processing a workpiece using fluorine radicals | Electricity | 1 | Active |
| US11276560B2 | Spacer etching process | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.