Patent · US Active

Lead frame

US10727171B2 · kind B2 · utility

0Cited by

2References

8Claims

0Family size

Assignee

Ohkuchi Materials Co., Ltd. · JP

Inventors

Kaoru Hishiki · Isa, JP
Ryouichi Yoshimoto · Isa, JP
Ichinori Iidani · Kagoshima, JP

Key dates

Filing date	Nov 28, 2017
Grant date	Jul 28, 2020
Priority date	—
Expiry date	Nov 28, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16245
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead frame includes a plurality of leads formed from a metal plate having a front side and a back side, a first resin member, and a second resin member. The leads have side faces thereof fixed with the first resin member. Faces serving as internal connectors of the leads are uncovered on the side of the front-side surface of the first resin member, and faces serving as external connectors of the leads are uncovered on the side of the back-side surface of the first resin member. The second resin member is formed on the front-side surface of the first resin member to be at a level higher than the faces serving as the internal connectors, and has openings for leaving the faces serving as the internal connectors uncovered.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.