Kaoru Hishiki
15Patents
2h-index
9Co-inventors
39Inventor score
Filing activity: Mar 11, 2014 → Mar 27, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10903150B2 | Lead frame | Electricity | 3 | Active |
| US9735096B1 | Lead frame and method for manufacturing the same | Electricity | 2 | Active |
| US10847451B2 | Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor element | Electricity | 2 | Active |
| US10312187B2 | Multi-row wiring member for semiconductor device and method for manufacturing the same | Electricity | 1 | Active |
| US10777492B1 | Substrate for mounting semiconductor element | Electricity | 1 | Active |
| US10727171B2 | Lead frame | Electricity | 0 | Active |
| US10811346B2 | Lead frame | Electricity | 0 | Active |
| US9735106B2 | Semiconductor lead frame, semiconductor package, and manufacturing method thereof | Electricity | 0 | Active |
| US10453782B2 | Multi-row wiring member for semiconductor device and method for manufacturing the same | Electricity | 0 | Active |
| US10763202B2 | Multi-row wiring member for semiconductor device and method for manufacturing the same | Electricity | 0 | Active |
| US11404286B2 | Lead frame | Electricity | 0 | Active |
| US9870930B2 | Method for producing substrate for mounting semiconductor element | Electricity | 0 | Active |
| US10763196B1 | Lead frame | Electricity | 0 | Active |
| US11062983B2 | Substrate for mounting semiconductor element | Electricity | 0 | Active |
| US10305007B2 | Multi-row LED wiring member and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.