Sintering pastes with high metal loading for semiconductor die attach applications
US10727193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2016 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Apr 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01058
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T1, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T1, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.