Patent · US Active

Embedded-bridge substrate connectors and methods of assembling same

US10727197B2 · kind B2 · utility

0Cited by

1References

23Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Bernd Waidhas · Nittendorf, DE
Georg Seidemann · Landshut, DE
Andreas Wolter · Regensburg, DE
Thomas Wagner · Regelsbach, DE
Stephan Stoeckl · Schwandorf, DE
Laurent Millou · Munich, DE

Key dates

Filing date	Mar 21, 2017
Grant date	Jul 28, 2020
Priority date	—
Expiry date	Mar 22, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.