Micropillar-enabled thermal ground plane

US10731925B2 · kind B2 · utility

Assignee

• The Regents of the University of Colorado, a Body Corporate · US

Inventors

• Ryan John Lewis · Boulder, US
• Li-Anne Liew · Westminster, US
• Ching-Yi Lin · New York, US
• Collin Jennings Coolidge · Erie, US
• Shanshan Xu · Beijing, CN
• Ronggui Yang · New York, US
• Yung-Cheng Lee · Boulder, US

Key dates

• Filing date: Sep 17, 2015
• Grant date: Aug 4, 2020
• Expiry date: Aug 3, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K7/20336
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.