Hybrid lead frame for semiconductor die package with improved creepage distance

US10734311B2 · kind B2 · utility

Assignee

• NXP USA, Inc. · US

Inventors

• Mariano Layson Ching, Jr. · Tianjin, CN
• Burton J. Carpenter · Austin, US
• Lidong Zhang · Hagfors, SE
• Kendall D. Phillips · Driftwood, US
• Quan Chen · Tianjin, CN
• Meng Kong Lye · Shah Alam, MY

Key dates

• Filing date: Jan 7, 2019
• Grant date: Aug 4, 2020
• Expiry date: Jan 7, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of packaged semiconductor devices and lead frames for such devices are provided, such as a lead frame including: a row of lead fingers, wherein an outer end of each lead finger is connected to a leaded side of the lead frame; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein an inner end of each lead finger falls within the package body perimeter; a retention tab that protrudes from an interior edge of a non-leaded side of the lead frame, wherein the retention tab falls outside of the package body perimeter; and a non-conductive tie bar structure attached to the retention tab, wherein the non-conductive tie bar structure falls within the package body perimeter.