Quan Chen
6Patents
1h-index
18Co-inventors
44Inventor score
Filing activity: Sep 9, 2010 → Feb 11, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9196557B1 | Protective packaging for integrated circuit device | Electricity | 1 | Active |
| US8652384B2 | Method for molding semiconductor device | Electricity | 0 | Active |
| US10734311B2 | Hybrid lead frame for semiconductor die package with improved creepage distance | Electricity | 0 | Active |
| US12284912B2 | Compound and an organic semiconducting layer, an organic electronic device and a display or lighting device comprising the same | Electricity | 0 | Active |
| US12144253B2 | Compound and an organic semiconducting layer, an organic electronic device and a display or lighting device comprising the same | Electricity | 0 | Active |
| US8625286B2 | Housing of portable electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.