Semiconductor workpiece temperature measurement system
US10739208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2018 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Apr 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/20221
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.