Patent · US Active

Electronic device, electronic module and methods for fabricating the same

US10741402B2 · kind B2 · utility

1Cited by

3References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Paul Frank · Villach, AT
Gretchen Adema · Raleigh, US
Thomas Bertaud · Villach, AT
Michael Ehmann · Villach, AT
Eric Graetz · Klagenfurt, AT
Kamil Karlovsky · Villach, AT
Evelyn Napetschnig · Diex, AT
Werner Robl · Regensburg, DE
Tobias Schmidt · Munich, DE
Joachim Seifert · Schwerte, DE
Frank Wagner · Reiskirchen, DE
Stefan Woehlert · Villach, AT

Key dates

Filing date	Aug 31, 2017
Grant date	Aug 11, 2020
Priority date	—
Expiry date	Aug 31, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.