Inventor · Regensburg, DE

Werner Robl

25Patents
5h-index
67Co-inventors
68Inventor score

Filing activity: Sep 28, 2001 → Jul 10, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US6720212B2 Method of eliminating back-end rerouting in ball grid array packaging Electricity 69 Expired
US6734097B2 Liner with poor step coverage to improve contact resistance in W contacts Electricity 18 Expired
US8148257B1 Semiconductor structure and method for making same Electricity 11 Active
US6866943B2 Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level Emerging Cross-Sectional Technologies 6 Expired
US8338317B2 Method for processing a semiconductor wafer or die, and particle deposition device Electricity 5 Active
US8334202B2 Device fabricated using an electroplating process Electricity 2 Active
US8330274B2 Semiconductor structure and method for making same Electricity 2 Active
US8665054B2 Semiconductor component with coreless transformer Electricity 1 Active
US10741402B2 Electronic device, electronic module and methods for fabricating the same Electricity 1 Active
US6794282B2 Three layer aluminum deposition process for high aspect ratio CL contacts Electricity 1 Expired
US11615963B2 Electronic device, electronic module and methods for fabricating the same Electricity 0 Active
US11276624B2 Semiconductor device power metallization layer with stress-relieving heat sink structure Electricity 0 Active
US8786085B2 Semiconductor structure and method for making same Electricity 0 Active
US9418937B2 Integrated circuit and method of forming an integrated circuit Electricity 0 Active
US9425146B2 Semiconductor structure and method for making same Electricity 0 Active
US11171049B2 Semiconductor device and a method of forming the semiconductor device Electricity 0 Active
US6960306B2 Low Cu percentages for reducing shorts in AlCu lines Electricity 0 Expired
US10332793B2 Self-organizing barrier layer disposed between a metallization layer and a semiconductor region Electricity 0 Active
US10648096B2 Electrolyte, method of forming a copper layer and method of forming a chip Electricity 0 Active
US8072071B2 Semiconductor device including conductive element Electricity 0 Active
US7909978B2 Method of making an integrated circuit including electrodeposition of metallic chromium Chemistry; Metallurgy 0 Active
US7974120B2 Spin device Electricity 0 Active
US6943114B2 Integration scheme for metal gap fill, with fixed abrasive CMP Emerging Cross-Sectional Technologies 0 Expired
US8759207B2 Semiconductor structure and method for making same Electricity 0 Active
US10446469B2 Semiconductor device having a copper element and method of forming a semiconductor device having a copper element Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.