Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices
US10748867B2 · kind B2 · utility
4Cited by
26References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2012 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Jul 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.