Package structure and bonding method thereof
US10756050B2 · kind B2 · utility
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2References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Oct 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The pads are disposed on the first substrate, and fill the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.