Cooling structure for electronic boards
US10757833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Jun 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.